Join us Wednesday, July 7th from 8:00am to 8:45am PDT
With the rapid growth in QFN packaging solutions, IC Test Engineering teams need innovative test socket solutions in order to meet the performance and time-to-market demands for their products. Package test setups to support advanced RF, Analog, Power Management, and High-Speed Digital IC’s require excellent signal integrity, reliable and repeatable contact resistance, and long production lifetimes. Meeting these challenges, Smiths Interconnect is proud to introduce Joule-20.
Join our semiconductor test experts to learn about the many benefits of the Joule-20 socket solution. We will outline how Joule-20 can provide a drop-in replacement that can be used with existing PCB footprints, brining you increased ROI in both Engineering / Characterization applications as well as High Volume Manufacturing. Designed from the ground-up to provide the optimal combination of performance, ease of use, and best-in-class Total Cost of Ownership, Joule-20 can support a wide range of package types and signal requirements. We will step you through Joule-20’s architecture in detail, and show you how you can reduce Load Board PCB pad damage, save time, and lower costs by partnering with a global leader in semiconductor test sockets.
Backed by Smiths Interconnect worldwide team of Field Applications experts, Joule-20 brings you valuable new options for QFN package testing operations. Please join us to learn about how the many ways this newest test socket product line from Smiths Interconnect can benefit your IC test engineering operations.
Presented by
Rick Marshall,
Global Business Development, Semiconductor Test
Rick Marshall is a veteran of the semiconductor test industry, having held leadership positions at suppliers of Capital Equipment, Wafer Probing, Final Test, and Production Software companies. Over 25 years of experience creating, driving, and closing hundreds of millions of dollars of business with customers based in the US, Europe, and Asia. Global Sales experience based on numerous positions in Silicon Valley, Texas, Hong Kong, and Singapore. Rick has worked for Smiths Interconnect for almost 4 years.
Tim Wooden,
Product Line Manager, Semiconductor Test
Tim Wooden is an expert in semiconductor package test, with deep experience in the design, deployment, and application of advanced test socket solutions, System Level, RF Testing, PoP, SoC, High Power, Thermal and Fine Pitch. With specific expertise in Technical Sales, Product Development, Marketing and Business Development, Tim has worked for Smiths Interconnect for almost two years.
