Enabling a connected society: Designing 5G chips

Sponsored by: GSEF

Focused on:

  • 5g Market Dominance
  • Consumer Electronics
  • 5g Chips

Date: 24 January


Time: 3PM London/10AM New York

The global impact of 5G

The fifth generation of the wireless network is fast approaching with the promise of faster and better data transfer. This evolutionary phase of 4G is expected to withstand the large amount of data and connectivity of today’s consumer electronics. Technologies like autonomous vehicles, IoT devices and other next-generation electronics possess a high number of sensors constantly accumulating data. 5G will provide greater speed, lower latency and the ability to connect several devices simultaneously; and the increased speed of data transfer will dramatically enhance the overall experience.

This webinar will aim to evaluate the transition between 1G, 2G, 3G, 4G and now 5G. With the timeline better understood we will move forward to exploring the industry drivers for 5G and how industries like semiconductor and consumer electronics can collectively overcome challenges around designing and creating 5G chips, and building 5G infrastructure.

The webinar is the last in our series ahead of the Global Semiconductor and Electronics Forum held on 13th – 15th March 2019 in Shanghai, China where the topic of 5G will be covered in more detail. GSEF brings together representatives from the semiconductor and consumer electronics industry i.e. chip developers to final application creators, to network, explore current industry trends and find solutions to business-hindering challenges. More about the forum can be found here.

Do not miss an opportunity to be a part of this exciting discussion, meet our expert panel speakers and pose your questions during the live broadcast.

Presented by

Dr. Jonghae Kim,

Director, Advanced Process/PKG/Passive integration for 5G System, Qualcomm Incorporation

He is currently as a Director to develop Advanced Process/PKG/Passive integration for 5G system integration since he joined in Qualcomm Incorporation, San Diego in 2008. Before he takes roles at Qualcomm, he worked as a senior engineer to develop Silicon-on-Insulator technology (130nm to 32nm nodes for 8 years) for Low power/RF applications in IBM, NY. He also worked as RF system engineering/manager to develop cellular RF frontends (multiple standards for 10 years) at Samsung Electronics. Through his entire work-activities, he has published over 70 papers in conferences/Journals and he holds over 150 US granted patents. His main interest is currently to generate the breakthroughs/value-propositions for the next 5G integration driven by smaller size, higher performance, lower cost and more integration. He got a PhD Degree at Electrical and Computer Engineering Department in University Minnesota at Minneapolis.

Glen Hunt,

Principal Analyst, Global Telecom Technology and Software

Glen is a Principal Analyst in Global Telecom Technology and Software, covering telecommunications infrastructure and Software Defined Networking. Glen analyzes technology, product, and partnership initiatives of vendors who supply infrastructure solutions to fixed and mobile network operators; specifically focusing on vendors that supply mobile core and transport, NFV infrastructures (NFVI), and management systems as well as routing and switching solutions.

Xin Wu,

PhD, Vice President, Silicon Technology, Xilinx, INC

Xin Wu received degrees of PhD and MSc from Electrical Engineering, University California, Berkeley and from Peking University, China respectively. He joined Xilinx in 1993, worked from 0.6um till now more than 14 generations of technologies, from many foundries. He is responsible of silicon technology, 3D-IC, advanced packaging, system thermal & mechanical solutions and other new technologies development in Xilinx.

Key Learning Objectives

  • Assess the five phases of connectivity to understand what the future will look like.
  • Explore how to best design and create 5G chips.
  • Understand ways to overcome challenges with power, infrastructure and accessibility.
  • Examine who will achieve market dominance.


  • VP of Engineering
  • Chief Operating Officer
  • Chief Executive Officer
  • Chief Technology Officer
  • Executive/Senior Vice President Research & Development
  • Executive/Senior Vice President Manufacturing
  • Executive/Senior Vice President Design
  • Executive/Senior Vice President Operations
  • Executive/Senior Vice President Technology
  • Executive/Senior Vice President Engineering
  • Executive/Senior Vice President Product Line/Function
  • Chief Innovation Officer
  • Director of 5G
  • Software Lead
  • Senior director of 5G engineering